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東莞選擇優質的美國貝格斯導熱墊片就選GapPadHC3.0

放大字體  縮小字體 發布日期:2017-04-10  瀏覽次數:3138
核心提示:Bergquist GapPadHC3.0柔軟有基材間隙填充導熱材料材料生產商:美國貝格斯(BERGQUIST)公司研發產品GapPadHC3.0可供規格:厚度(
  

Bergquist GapPadHC3.0柔軟有基材間隙填充導熱材料

材料生產商:美國貝格斯(BERGQUIST)公司研發產品

GapPadHC3.0可供規格

厚度(Thickness)0.25mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm

片材(Sheet)8”×16”(203×406 mm)

卷材(Roll)

導熱系數(Thermal Conductivity)3.0W/m-k

基材(Reinfrcement Carrier)玻璃纖維

膠面(Glue)雙面自帶粘性

顏色(Color)藍色

包裝(Pack)美國原裝進口包裝

抗擊穿電壓(Dielectic Breakdown Voltage)(Vac):>5000

持續使用溫度(Continous Use Temp):-60°~200°

GapPadHC3.0應用材料特性:

GapPadHC3.0在非常低的壓力下,低的S系列熱阻,高的貼服性,S系列軟度。針對低應力應用設計

玻纖增強,提高加工性能和搞斯裂性

GapPadHC3.0材料應用:

處理器,服務器S-RAMS,大容量存儲驅動器,有線/無線通訊硬件,筆記本電腦,BGA封裝,功率轉換器

GapPadHC3.0技術優勢分析:

GapPadHC3.0導熱界面材料系列以更好的貼服性,更高的導熱性能及易于應用來滿足電子工業對導熱界面材料的日益增長的需要;在凹凸不平的表面,空氣間隙和表面粗糙的散熱器與電子元器件之間,廣泛的GapPadHC3.0提供一個有效的導熱界面。

Gap Pad® HC 3.0 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. Gap Pad® HC 3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness

and/or topography.

Gap Pad® HC 3.0 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.

 
關鍵詞: GapPadHC3.0
 
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